Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-m gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 m and 500 m.
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501